Ultrasonic Embedding + MOA2/MOA4 card inlay

It is a standard way to product a RF contectless card of high frequency card only, with structure MOA2/MOA4 + Ultrasonic embedding antenna +electric welding
Advantage
1, High quality, uniform antenna frequency
2, Flat surface, 
3, Better thickness of card
4, Automatic production line
Weakness
1,  Expensive equipment need
2,  Higher cost of card
3,  Violate Patent in USA and America